Crack deflector structure for improving semiconductor device robustness against saw-induced damage
US8912076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2009 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Jan 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit containing a crack deflecting scribe seal which separates an interior region of the integrated circuit from a scribeline immediately outside the integrated circuit and a method of forming the same. The crack deflecting scribe seal includes continuous metal layers and continuous contacts and continuous vias between the continuous metal layers. The continuous metal layers do not extend past the continuous contacts and continuous vias. The continuous contacts and continuous vias are recessed from edges of the underlying continuous metal layers on the scribeline side of the scribe seal, providing an angled outer surface on the scribe seal which may desirably terminate crack propagation or deflect crack propagation upward to a top surface of the scribeline or the crack deflecting scribe seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.