Curable silicone composition for sealing an optical semiconductor element, method of producing a resin-sealed optical semiconductor element, and resin-sealed optical semiconductor element
US8912302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2012 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Sep 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable silicone composition for sealing an optical semiconductor element, comprising: (A) an organopolysiloxane that has at least two silicon-bonded vinyl groups in one molecule, that has C1-10 alkyl for the other silicon-bonded organic groups therein, and that lacks a siloxane unit represented by the following formula: SiO4/2; (B) an organopolysiloxane represented by an average unit formula; (C) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule, that has C1-10 alkyl for the silicon-bonded organic groups therein, and that contains from 0.7 to 1.6 mass % of silicon-bonded hydrogen atoms; and (D) a hydrosilylation reaction catalyst, wherein a viscosity at 25° C. and a viscosity at 100° C. of this composition lacking component (D) reside in a specific relationship, can efficiently perform resin sealing by transfer molding or compression molding while exhibiting an excellent moldability and can provide a cured product that has a low surface tack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.