Electronic component package
US8912453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2010 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Mar 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.