Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)

US8913384B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Milnes P. David · Fishkill, US
• David P. Graybill · Staatsburg, US
• Madhusudan K. Iyengar · Woodstock, US
• Vinod Kamath · Raleigh, US
• Bejoy J. Kochuparambil · Apex, US
• Pritish R. Parida · Fishkill, US
• Roger R. Schmidt · Poughkeepsie, US
• Mark E. Steinke · Durham, US

Key dates

• Filing date: Jun 20, 2012
• Grant date: Dec 16, 2014
• Expiry date: Dec 14, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49002
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.