Cooling module for cooling electronic components
US8913386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2012 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Jan 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.