Thermally conductive printed circuit board bumpers
US8913390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2012 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Feb 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/205
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.