Force sensor with wings and force distribution component

US8915152B2 · kind B2 · utility

Assignees

• Micronas GmbH · DE
• Albert-Ludwigs-Universitaet Freiburg · DE

Inventors

• Marc Baumann · Glückstadt, DE
• Patrick Ruther · Karlsruhe, DE
• Alexander Peter · San Fernando, US
• Oliver Paul · Freiburg im Breisgau, DE

Key dates

• Filing date: Sep 13, 2012
• Grant date: Dec 23, 2014
• Expiry date: Dec 23, 2032

Classification

• Technology area (CPC G): Physics
• CPC primary: G01L9/0054
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A force sensor comprising a substrate, a semiconductor body, and a piezoresistive element provided on a top surface of the semiconductor body. The semiconductor body is connected to the substrate in a force-fit manner, and includes a first wing which is provided on the top surface of the semiconductor body and being connected to the semiconductor body in a force-fit manner. A first force application area is provided on the first wing. A second wing has a second force application area provided opposite the first wing. The piezoresistive element is disposed between the first wing and the second wing. A force distribution component is connected to the first force application area and the second force application area in a force-fit manner. The force distribution component having a first surface which is oriented away from the top surface of the semiconductor body and includes a third force application area.