Method for producing a flexible circuit configuration

US8915489B2 · kind B2 · utility

Assignee

• Cicor Management AG · CH

Inventors

• Ernst Feurer · Blaustein, DE
• Bruno Holli · Ulm, DE
• Alexander Kaiser · Neutraubling, DE
• Karin Ruess · Stuttgart, DE

Key dates

• Filing date: Apr 9, 2013
• Grant date: Dec 23, 2014
• Expiry date: Apr 9, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S269/903
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.