Multi-dimensional component build system and process
US8915728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2012 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Aug 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An example multi-dimensional component building system includes a first chamber having at least one base, a second chamber adjacent to and in fluid communication with the first chamber through a first door, and a third chamber adjacent to and in fluid communication with the second chamber through a second door. The second chamber is fluidly sealed from the first chamber if the first door is in a closed position. The second chamber includes a directed heat source, a build-up material and is configured to receive the at least one base if the fluid parameters of the first chamber and second chamber are approximately equal. The third chamber is fluidly sealed from the second chamber if the first door is in a closed position. The third chamber is configured to receive the at least one base, having a formed component disposed thereon, if the second door is in an open position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.