Patent · US Active

Assembly bonded to a structural adhesive and method and applicator for making it

US8916020B2 · kind B2 · utility

0Cited by

24References

13Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

Jan D. Forster · Essen, DE
Dirk Hasenberg · Raeren, BE
Siegfried R. Goeb · Willich, DE
Christopher J. Campbell · Burnsville, US

Key dates

Filing date	Nov 26, 2008
Grant date	Dec 23, 2014
Priority date	—
Expiry date	Jul 29, 2030

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2400/166
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The invention provides an assembly comprising at least one substrate being bonded to a structural adhesive wherein the structural adhesive is obtained by curing a precursor comprising a cross-linkable polymer, wherein a surface area of the substrate bonded to the structural adhesive comprises at least one metal, said surface area being treated with a liquid activator.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.