Adhesive composition for detachable adhesive bonds and modification of the encapsulation materials for a purposeful energy input
US8916267B2 · kind B2 · utility
6Cited by
5References
6Claims
0Family size
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Key dates
| Filing date | Jan 24, 2013 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Jun 22, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31605
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material. The particles of the expansion material are at least partially encapsulated. A bond of at least two components and an adhesive layer includes an adhesive composition based on adhesive matrices and expansion material. The bonded components may include metal, plastic, wood, glass, natural or synthetic materials or a composite material thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.