Patent · US Active

Adhesive composition for detachable adhesive bonds and modification of the encapsulation materials for a purposeful energy input

US8916267B2 · kind B2 · utility

6Cited by
5References
6Claims
0Family size

Assignees

Inventors

Key dates

Filing dateJan 24, 2013
Grant dateDec 23, 2014
Priority date
Expiry dateJun 22, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31605
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material. The particles of the expansion material are at least partially encapsulated. A bond of at least two components and an adhesive layer includes an adhesive composition based on adhesive matrices and expansion material. The bonded components may include metal, plastic, wood, glass, natural or synthetic materials or a composite material thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.