Processes and compositions for removing substances from substrates

US8916338B2 · kind B2 · utility

Assignee

• Eastman Chemical Company · US

Inventors

• Michael Wayne Quillen · Jonesborough, US
• Dale Edward O'Dell · Bristol, US
• Zachary Philip Lee · Conyers, US
• John Cleaon Moore · Vail, US
• Edward E. McEntire · Austin, US
• Spencer Erich Hochstetler · Kingsport, US
• Richard D. Peters · Westfield, US
• Rodney Scott Armentrout · Kingsport, US
• Darryl W. Muck · Kingsport, US

Key dates

• Filing date: Nov 19, 2013
• Grant date: Dec 23, 2014
• Expiry date: Nov 19, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/31133
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.