Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure
US8916393B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Sep 21, 2012 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Mar 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional integrated structure may include two assembled integrated circuits respectively including two metallic lines, and at least two cavities passing through one of the integrated circuits and opening onto two locations respectively in electrical contact with the two metallic lines. The cavities may be sized to place a measuring apparatus at the bottom of the cavities, and in electrical contact with the two locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.