Patent · US Active

Method for producing an electronic component and electronic component

US8916397B2 · kind B2 · utility

4Cited by
10References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 29, 2009
Grant dateDec 23, 2014
Priority date
Expiry dateNov 12, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical vapor deposition (PECVD).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.