Method for producing an electronic component and electronic component
US8916397B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2009 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Nov 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical vapor deposition (PECVD).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.