Tape substrate with chip on film structure for liquid crystal display panel
US8916779B2 · kind B2 · utility
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7Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 26, 2011 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Dec 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15788
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a tape substrate with COF structures for a liquid crystal display panel. A plurality of package units with the COF structures are arranged along a longitudinal direction of the tape substrate. Each of the package units includes input leads and output leads. In each of the package units, along the longitudinal direction of the tape substrate, the input leads and the output leads are disposed at both sides of the tape substrate, respectively. The present invention further provides the liquid crystal display panel using the tape substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.