Laser machining apparatus with switchable laser system and laser machining method
US8916798B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 14, 2012 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Feb 1, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/083
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.