Semiconductor packages
US8916875B2 · kind B2 · utility
13Cited by
8References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 14, 2012 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Mar 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor package and a chip package of the same. The semiconductor package includes: a first semiconductor chip mounted on a first package substrate; a chip package stacked on the first semiconductor chip; and a first terminal connecting the chip package directly and electrically to the first semiconductor chip, wherein the chip package includes a second semiconductor chip mounted on a second package substrate, and the second package substrate includes a first pad coupled to the first terminal and a second pad electrically connected to the first pad and electrically spaced apart from the first terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.