Reconfigurable RF/digital hybrid 3D interconnect
US8916910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2010 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Jul 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Reconfigurable 3D interconnect is provided that can be used for digital and RF signals. The reconfigurable 3D interconnect can include an array of vertical interconnect vias (or TSVs) providing a signal path between a first core element of a 3D IC and a second core element of the 3D IC stacked above the first core element. A routing circuit can be used to route a signal from the first core element to the second core element through selected TSVs of the array of TSVs providing the signal path between the first core element and the second core element. The routing circuit allows re-routing of the signal through different selected TSVs during operation, which can provide real time adjustments and capacity optimization of the TSVs passing the particular signal between the elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.