Cooling device, electronic substrate and electronic device
US8917507B2 · kind B2 · utility
4Cited by
21References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 16, 2010 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Dec 3, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/083
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape. A front surface of the thermal diffusion unit thermally contacts a first circuit mounting surface of the electronic substrate. A rear face of the thermal diffusion unit thermally contacts a second circuit mounting surface of the electronic substrate. And, the thermal diffusion unit diffuses heat from the heating element according to vaporization and condensation principles of a refrigerant sealed therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.