Reversibly adhesive thermal interface material
US8917510B2 · kind B2 · utility
16Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2011 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Aug 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.