Nozzled device to align a substrate on a surface
US8919528B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 13, 2012 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Dec 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0413
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method system and device, to align a substrate on a surface, the device including a first intake and a second intake where the first intake is configured to accept a first fluid and the second intake is configured to accept a second fluid. The first fluid is channeled into the device to vertically move the device a distance, and the second fluid calibrated and channeled into the nozzle, the nozzle having a focusing outlet, and where the fluids are configured to exert a force to facilitate the alignment of the substrate on the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.