Radio frequency identification (RFID) tag and manufacturing methods thereof
US8919655B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2011 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Mar 14, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07775
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A radio frequency identification (RFID) device is disclosed. The RFID device includes a silicon substrate having a top side and a bottom side. The RFID device also includes a plurality of circuitry layers formed on the top side of the substrate, and the plurality of circuitry layers include at least a core circuitry and an on-chip antenna. Further, the RFID device includes a plurality of deep openings formed in the substrate on the bottom side under the plurality of circuitry layers. The plurality of deep openings are arranged in an array and through a substantial portion of the substrate, and a remaining portion of the substrate unreached by the plurality of deep openings separates the plurality of deep openings and the plurality of circuitry layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.