Patent · US Active

Communications module with a shell assembly having thermal mechanical features

US8920048B2 · kind B2 · utility

2Cited by

9References

22Claims

0Family size

Assignee

FINISAR CORPORATION · US

Inventors

Chris Togami · San Jose, US
Frank Flens · Campbell, US
Tat Ming Teo · Singapore, SG

Key dates

Filing date	May 26, 2011
Grant date	Dec 30, 2014
Priority date	—
Expiry date	Jun 4, 2033

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/4281
WIPO fieldOptics
WIPO sectorInstruments

Abstract

In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.