Patent · US Active

Cleaning device and a cleaning method of a fixed abrasives polishing pad

US8920572B2 · kind B2 · utility

3Cited by

4References

6Claims

0Family size

Assignee

Semiconductor Manufacturing International (Shanghai) Corporation · CN

Inventor

Feng Chen · Shanghai, CN

Key dates

Filing date	Aug 17, 2011
Grant date	Dec 30, 2014
Priority date	—
Expiry date	Jan 13, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/245
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.