Method of bonding conductive material to stainless steel, and HDD magnetic head suspension
US8920887B2 · kind B2 · utility
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18References
1Claims
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Key dates
| Filing date | Dec 29, 2011 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | May 7, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of bonding a conductive material to stainless steel includes: a first step of applying a conductive paste to a surface of a base plate made of the stainless steel; and a second step of removing, in an area located within the surface of the base plate and covered with the conductive paste, a part of a passivation film on a surface of the stainless steel without allowing a base material of the stainless steel of the base plate to come into contact with air. The removing of the passivation film is achieved, for example, by irradiation of laser light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.