Patent · US Active

Method of manufacturing MEMS devices with reliable hermetic seal

US8921128B2 · kind B2 · utility

2Cited by

4References

19Claims

0Family size

Assignee

Analog Devices, Inc. · US

Inventors

Li Chen · Village of La Jolla, US
Kuang L. Yang · Newton, US

Key dates

Filing date	May 29, 2013
Grant date	Dec 30, 2014
Priority date	—
Expiry date	Jul 25, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C99/0045
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

Manufactured capped MEMS device wafers are tested for hermeticity on a vacuum prober at differing pressures or on a wafer prober at differing temperatures. Resonant frequency testing is conducted. Leaking MEMS devices are distinguished from the remaining MEMS devices on the basis of quality factor (“Q”) measurements obtained from the resonant frequency testing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.