Circuit board, structural unit thereof and manufacturing method thereof
US8921703B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2013 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Jul 26, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board, structural units and a manufacturing method are provided, wherein one or more high temperature lamination processes are conducted for laminating the structural units and form a multi-layered circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.