Patent · US Active

Integrated circuit combination of a target integrated circuit and a plurality of photovoltaic cells connected thereto using the top conductive layer

US8921967B2 · kind B2 · utility

1Cited by

6References

12Claims

0Family size

Assignee

Sol Chip Ltd. · IL

Inventors

Shani Keysar · Haifa, IL
Reuven Holzer · Herzliya, IL
Ofer Navon · Rehovot, IL
Ram Friedlander · Haifa, IL

Key dates

Filing date	Dec 19, 2011
Grant date	Dec 30, 2014
Priority date	—
Expiry date	Dec 19, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) combination of a target integrated circuit (TIC) and a plurality of thin film photovoltaic cells (PV) connected thereto. The IC comprises a target integrated circuit (TIC) having a top surface and a bottom surface; a plurality of thin film photovoltaic (PV) cells formed over at least one of the top surface and the bottom surface of the TIC, each PV cell includes at least a lower conducting layer (LCL) and an upper conducting layer (UCL); and a conducting path connecting at least a UCL of a first PV cell to at least a LCL of a second PV cell, wherein at least a first array of PV cells comprised of at least a first portion of the plurality of PV cells is connected by the respective UCL and LCL of each PV cell to provide a first voltage output.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.