Fibrous laminate interface for security coatings
US8921971B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 14, 2014 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Apr 14, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.