Active cooling fin pack
US8922990B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2012 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Jun 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves the heat through a fin pack and out an exhaust vent. The fin packs described herein may include a blade at the exit end of the fin pack. The blade is oriented between the end wall of a computing device and the exit of the fin pack. The blade both keeps the air creating hot spots at the surface of the computing device and provides additional surface area for moving heat away from the heat pipe. The blade may have different configurations, for example, a generally rectangular shape or an arced-shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.