Bonding head with a heatable and coolable suction member
US8925608B2 · kind B2 · utility
4Cited by
6References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 17, 2014 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Jan 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75745
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.