Joining process for superalloys
US8925792B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2013 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Aug 31, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of bonding superalloys is provided. The method includes: aligning a first superalloy subcomponent having a gamma-prime solvus g′1 and a second superalloy subcomponent having a gamma-prime solvus g′2, with a filler material that includes at least 1.5 wt % boron disposed between the first and second superalloy subcomponents; performing a first heat treatment at a temperature T1, where T1 is above the solidus of the filler material and below the liquidus of the filler material; and performing a second heat treatment at a temperature T2, where T2 is greater than T1, and where T2 is greater than or equal to the lower of g′1 and g′2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.