Method for making a solder joint
US8925793B2 · kind B2 · utility
2Cited by
173References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2012 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Dec 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0415
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.