Method for improving connector enclosure adhesion
US8926337B2 · kind B2 · utility
5Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2012 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Mar 5, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved method is employed to attach an enclosure to a connector body having relatively small geometry. One or more bonding channels are disposed in the outside surface of the connector body. During assembly of an enclosure over the connector body, a bonding material is distributed within the bonding channels and subsequently cured. The bonding channels and the bonding material are designed to employ capillary wicking to aid in the distribution of the bonding material within the bonding channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.