High performance, small form factor connector with common mode impedance control
US8926377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2010 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Aug 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R25/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.