Lift-off deposition system featuring a density optimized HULA substrate holder in a conical deposition chamber
US8926755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2010 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Aug 6, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/505
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vapor deposition device using a lift-off process includes an evaporation source, a support frame mounted for rotation about a first axis that passes through the evaporation source, a central dome-shaped wafer holder mounted to the support frame wherein a centerpoint of the central dome-shaped wafer holder is aligned with the first axis, an orbital dome-shaped wafer holder mounted to the support frame in a position offset from the first axis and rotatable about a second axis that passes through a centerpoint of the orbital dome-shaped wafer holder and the evaporation source, and a plurality of wafer positions on the central dome-shaped wafer holder and the orbital dome-shaped wafer holder where each of the wafer positions are offset from the first axis and the second axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.