Method of manufacturing light emitting device
US8927305B2 · kind B2 · utility
3Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2012 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Aug 16, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
There is provided a method of manufacturing a light emitting device, the method including: mounting a plurality of light emitting devices on an adhesive layer; arranging upper surfaces of the plurality of light emitting devices to be disposed horizontally using a pressing member; forming a wavelength conversion part covering the plurality of light emitting devices on the adhesive layer by applying a resin including at least one phosphor material; planarizing an upper surface of the wavelength conversion part using the pressing member; and separating the adhesive layer from the plurality of light emitting devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.