Patent · US Active

Leadframe for electronic components

US8927342B2 · kind B2 · utility

9Cited by

5References

27Claims

0Family size

Assignee

Tyco Electronics AMP GmbH · DE

Inventors

Peter Goesele · Bad Wurzach, DE
Friedrich Seger · Knittlingen, DE
Josef Sinder · Niendorf, DE
Joachim Stifter · Rochlitz, DE
Oliver Werner · Laatzen, DE

Key dates

Filing date	Oct 12, 2009
Grant date	Jan 6, 2015
Priority date	—
Expiry date	Sep 21, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.