Continuously scalable width and height semiconductor fins

US8927432B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Dechao Guo · Niskayuna, US
• Yang Liu · Shanghai, CN
• Chengwen Pei · Danbury, US
• Yue Tan · Fishkill, US

Key dates

• Filing date: Jun 14, 2012
• Grant date: Jan 6, 2015
• Expiry date: Aug 15, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D86/011

Abstract

Arbitrarily and continuously scalable on-currents can be provided for fin field effect transistors by providing two independent variables for physical dimensions for semiconductor fins that are employed for the fin field effect transistors. A recessed region is formed on a semiconductor layer over a buried insulator layer. A dielectric cap layer is formed over the semiconductor layer. Disposable mandrel structures are formed over the dielectric cap layer and spacer structures are formed around the disposable mandrel structures. Selected spacer structures can be structurally damaged during a masked ion implantation. An etch is employed to remove structurally damaged spacer structures at a greater etch rate than undamaged spacer structures. After removal of the disposable mandrel structures, the semiconductor layer is patterned into a plurality of semiconductor fins having different heights and/or different width. Fin field effect transistors having different widths and/or heights can be subsequently formed.