Assembly and deposition of materials using a superhydrophobic surface structure
US8927464B2 · kind B2 · utility
24Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2008 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Oct 26, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00206
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Fluidics-induced localized deposition and assembly of materials using a superhydrophobic surface structure is described. A method of localized deposition of a material includes contacting a superhydrophobic substrate comprising raised surface structures with a non-wetting fluid comprising a material to be locally deposited or a precursor thereto, said surface and said fluid selected such that the fluid wets only an upper portion of the raised surface structure; and allowing the material to deposit at the tips of the surface structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.