Through via structure including a conductive portion and aligned solder portion
US8928123B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 30, 2014 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | May 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate has a first surface and a second surface opposed to each other. A blind hole is formed in the substrate extending from the first surface at a location for each through via. Each blind hole is filled with a conductive filler; a deepest part of each filler forming a bump portion made of a solder material. Part of the substrate extending from the second surface is removed to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding solder bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.