Patent · US Active

Methods and systems for automated measurement of electrical bonds

US8928339B2 · kind B2 · utility

1Cited by

14References

20Claims

0Family size

Assignee

The Boeing Company · US

Inventors

Jason P. Bommer · Tacoma, US
Andrew M. Robb · Everett, US
Stephen L. Fahley · Renton, US

Key dates

Filing date	Oct 29, 2010
Grant date	Jan 6, 2015
Priority date	—
Expiry date	Jan 9, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG01N27/20
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A structure is described that includes a first faying surface, a second faying surface for creating an electrical bond with the first faying surface, and a sensor operatively placed proximate the first faying surface and the second faying surface. The sensor includes a current port for injecting a fixed current through the electrical bond, a voltage port for sensing a voltage across the electrical bond induced by the fixed current, a processing device programmed to determine a resistance of the electrical bond based on the fixed current and sensed voltage, and a wireless interface for transmitting at least one of the sensed voltage and the determined resistance to an external device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.