Wafer lens, laminated wafer lens, wafer lens cutting method and laminated wafer lens cutting method
US8928982B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2011 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Sep 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laminated wafer lens includes a wafer lens and a spacer substrate bonded to each other. The wafer lens includes a resin section provided on a surface of a glass substrate. The resin section includes lens portions and interval portions, each interval portion provided between adjacent lens portions. The spacer substrate has openings at positions corresponding to the respective lens portions. The lens portions are arrayed in row and column directions in a matrix fashion. The interval portions include first and second interval portions, the second interval portion longer than the first interval portion. The spacer substrate includes interval portions each of which is provided between adjacent openings. The interval portions include third and fourth interval portions corresponding to the first and second interval portions, respectively, the fourth interval portion being longer than the third interval portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.