Heat-dissipation structure and electronic device using the same
US8929076B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Aug 20, 2012 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Mar 3, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-dissipation structure includes a first carbon nanotube layer and a metal mesh layer. The first carbon nanotube layer and the metal mesh layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper. An electronic device applying the heat-dissipation structure is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.