Electronic circuit module component and method of manufacturing electronic circuit module component
US8929089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2011 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Mar 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249981
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.