Methods of patterning a conductor on a substrate
US8932475B2 · kind B2 · utility
2Cited by
27References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2013 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Mar 21, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.