Polyamide blend molding compound
US8932693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2010 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Sep 25, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/139
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyamide blend molding compound, includes a polyamide blend content and at least one impact-resistant component, characterized in that the polyamide blend content includes the following polyamides: (A) 20 to 65% by weight of at least one semi-crystalline polyamide with an enthalpy of fusion >40 J/g and with an average of at least 8 C atoms per monomeric unit; (B) 8 to 25% by weight of at least one amorphous and/or microcrystalline polyamide, with the microcrystalline polyamide having an enthalpy of fusion in the range of 4 to 40 J/g, and (C) 1 to 20% by weight of at least one polyamide with an average of a maximum of 6 C atoms per monomeric unit. The impact-resistant component includes as follows: (D) 10 to 40% by weight of a polyamide elastomer which is composed of hard segments and soft segments, with the hard segments being based on lactams and/or amino-carboxylic acids, and (E) 0 to 35% by weight of a non-polyamide elastomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.