Thermosetting resin composition and board using the same
US8932705B2 · kind B2 · utility
2Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2009 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Aug 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same.In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.