Polyurethane hot-melt adhesive produced from polyacrylates and polyesters
US8933163B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A solvent-free moisture-curing polyurethane hot-melt adhesive composition, in which the adhesive comprises the following components: 20 to 85 wt % of a polyurethane prepolymer with free isocyanate groups produced from at least one polyol from the group of polyether polyols, polyester polyols, polyalkylene polyols and mixtures thereof with an excess of at least one polyisocyanate, the prepolymer having a monomeric diisocyanate content of below 1 wt %, 4 to 40 wt % of at least one acrylate copolymer with a molecular weight of below 60,000 g/mol, 3 to 35 wt % of a thermoplastic polyester with a number-average molecular weight (MN) of below 6000 g/mol, which comprises fewer than 1.4 NCO-reactive groups, and 0 to 25 wt % of at least one additive from the group of catalysts, resins, plasticizers, fillers, pigments, stabilizers or adhesion promoters, the sum of the constituents being equal to 100 wt %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.