Heat transfer member and module with the same
US8933484B2 · kind B2 · utility
1Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2013 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Aug 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat transfer member is disposed between a semiconductor element and an electrode plate. The heat transfer member comprises a metal portion extending between a first face at the semiconductor element side and a second face at the plate electrode side, and a ceramic portion surrounding the metal portion. An area of the first face is less than an area of the second face in the metal portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.